Hiroshima University held the ”UPWARDS Summer Program 2026” from July 22 to August 2, 2026, as part of “UPWARDS for the Future,” an initiative that promotes human resource development and research exchange in the semiconductor field between universities in Japan and the United States.

A total of 12 students from Boise State University, Purdue University, Rochester Institute of Technology, Virginia Tech, and the University of Washington in the United States, as well as the Institute of Science Tokyo, Kyushu University, and Tohoku University in Japan, participated in the program. Centered at Hiroshima University’s Higashi-Hiroshima Campus, the program offered a wide range of activities, including semiconductor-related lectures and training, visits to research facilities and companies, Peace Study activities, cultural experiences, and student exchange activities.

“UPWARDS for the Future” is a Japan-U.S. university partnership in the semiconductor field that was announced at the G7 Hiroshima Summit in May 2023. Five Japanese universities and six U.S. universities participate in the initiative, which aims to strengthen collaboration between Japan and the United States through human resource development and research exchange in the semiconductor field.

Semiconductor training for this summer program was conducted mainly at the Research Institute for Semiconductor Engineering (RISE), Hiroshima University. Beginning with basic semiconductor knowledge and safety training, students gained hands-on experience through a series of activities, including layout design, semiconductor processing, tours of the cleanroom and equipment, and measurement and evaluation of the devices they had designed.
During the layout design training, students worked in groups on assigned tasks and also took on the challenge of creating their own designs and incorporating their individual ideas. Following a lecture on semiconductor processes, they toured the cleanroom and various equipment at RISE to deepen their understanding of semiconductor manufacturing processes and facilities. They then measured and evaluated the devices they had designed, gaining practical insight into how the various stages from design and fabrication to evaluation are interconnected.
The program also provided opportunities for participants to interact with RISE students, faculty, and staff, fostering interaction across universities and nationalities.
 

To deepen their understanding of the semiconductor industry, the students also visited Micron Memory Japan, Renesas Semiconductor Manufacturing, and Sumitomo Heavy Industries Material Solutions.

Visit to Micron Memory Japan

The program also included a Peace Study component, providing participants with an opportunity to reflect on the significance of studying in Hiroshima. They visited Hiroshima Peace Memorial Park, where they saw the Atomic Bomb Dome and toured the Hiroshima Peace Memorial Museum, and attended a talk by an A-bomb Legacy Successor. Through these experiences, the students learned about the realities of the atomic bombing and Hiroshima’s history and reflected on the importance of peace.

Visit to Hiroshima Peace Memorial Park

In addition, students experienced Hiroshima’s food culture by making okonomiyaki and visited the Shimanami Kaido, where they enjoyed views of the many islands of the Seto Inland Sea. These activities provided opportunities to experience Japanese culture and the attractions of the local region. They also helped deepen interaction among the participants and foster mutual understanding among students from different cultural backgrounds.

On the final day, the students gave group presentations on what they had learned and experienced during the program and reflected on their approximately two weeks together.

Through the program, participants not only deepened their specialized and practical knowledge of semiconductors but also broadened their international perspectives through the Peace Study, cultural and regional experiences, and interaction with students, faculty, and staff from Japan and the United States.

Hiroshima University will continue to promote student exchange as well as educational and research collaboration with its partner universities in Japan and the United States under the framework of “UPWARDS for the Future,” fostering human resources capable of playing active roles internationally in the semiconductor field

This program was conducted with support from Micron Technology and Tokyo Electron.