Email: kokusai-group*office.hiroshima-u.ac.jp
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On September 30, 2024, President Ewe Hong Tat of Universiti Tunku Abdul Rahman (UTAR) and Chairman Gary Tang Kok Lian of the Japan Graduates' Association of Malaysia (JAGAM) visited the Higashi-Hiroshima Campus of Hiroshima University (HU) and held a signing ceremony for the conclusion of MOUs with HU.
The MOU between HU and UTAR was initiated when Executive Vice President (Global Initiatives) Kaneko visited UTAR on April 29, 2024, and discussed with President Ewe the possibility of starting student exchange between the two universities. Subsequently, discussions were held on a wide range of exchanges, including student, research, and faculty exchanges through the START Program (short-term study abroad program) and the 3+1 Program (international student acceptance program) of HU, leading to the conclusion of this MOU.
This was followed by the signing of an MOU between HU and JAGAM. At the signing, President Ochi expressed his gratitude to Chairman Tang for his efforts in making the MOU possible, and his expectations for JAGAM's role as a bridge between the two countries.
After the signing ceremony, a campus tour was held, and the participants visited the Research Institute for Semiconductor Engineering and other facilities.
HU has concluded 7 inter-university international exchange agreements with 7 institutions and 4 inter-faculty international exchange agreements with 4 institutions in Malaysia. Currently, 13 students from Malaysia are studying at HU. In March 2014, HU established the Hiroshima University Malaysia Alumni Association.
The conclusion of these two agreements is expected to further strengthen the ties between HU and Malaysia in terms of student, education, and research exchanges.
Commemorative Photograph Taken After the MOU Signing with UTAR
Commemorative Photograph Taken After the MOU Signing with JAGAM
Group Photograph Commemorating the Signing of Two MOUs
Observing the Research Institute for Semiconductor Engineering
Group Photograph Taken After Observing the Research Institute for Semiconductor Engineering
Global Strategy Group, Hiroshima University