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HU Signs a Collaboration Agreement with Saijo City in Ehime Prefecture Regarding the Development of Global Human Resources in the Semiconductor Field

On October 29, 2025, at Saijo City Hall in Ehime Prefecture, Hiroshima University (HU) and Saijo City signed a collaboration agreement concerning the development of global human resources in the semiconductor field. From HU, President Mitsuo Ochi, Executive Vice President (Global Initiatives) Shinji Kaneko, and Director Akinobu Teramoto of the Research Institute for Semiconductor Engineering (RISE) were in attendance. Representing Saijo City were Mayor Toshiaki Takahashi, Vice Mayor Takushi Akehi, and Director Noritaka Saiki of the Department of Industrial and Economic Affairs.

This agreement aims to promote collaboration by linking the educational and research resources of HU with the regional characteristics and industrial foundation of Saijo City, with a central focus on developing global human resources in the semiconductor field. Through cooperation among industry, academia, and government, and by strengthening partnerships with semiconductor-related companies, the agreement seeks to expand opportunities for students to engage in practical and internationally oriented learning and research.

In his remarks, President Ochi stated: “For over 35 years, HU has been advancing education and research in the semiconductor field, fulfilling its role as a hub that connects the local community with the world. Our collaboration with Saijo City, where many semiconductor-related companies are concentrated, is of great significance across education, research, and industry. Through accepting student internships at companies in Saijo, we hope to further enhance human resource development in partnership with the region, as well as promote greater internationalization.”

Mayor Takahashi expressed his aspirations, stating: “While the semiconductor market is expected to continue growing in the future, a shortage of skilled human resources remains a major challenge. Through collaboration with HU, we hope to promote joint research and the acceptance of student internships at companies within the city, thereby contributing to the development of industries, including the semiconductor sector.”

HU, centered around RISE, has established a comprehensive research framework that spans from materials to devices, and from circuits to systems, positioning semiconductor research and development as a key strategic initiative. In addition, the university launched the Setouchi Semiconductor Consortium in 2023, working in collaboration with Hiroshima Prefecture, Higashihiroshima City, the Chugoku Bureau of Economy, Trade and Industry, and private companies. The consortium aims to strengthen the entire semiconductor supply chain and foster the development of next-generation talent.

Furthermore, the Value-Integrated Semiconductor Talent Acceleration (VISTA) Program, led by HU in collaboration with Okayama University, Yamaguchi University, and Ehime University, has been selected by the Ministry of Education, Culture, Sports, Science and Technology (MEXT) as part of the Education Network for Semiconductor Technologies (enSET) initiative to establish hubs for semiconductor talent development. In partnership with Micron Memory Japan and companies in the consortium, the program aims to nurture 3,000 skilled professionals over the next ten years.

In terms of international collaboration, HU joined the Japan-U.S. semiconductor partnership program “UPWARDS for the Future” in 2023, following the G7 Hiroshima Summit. Together with 10 other Japanese and American universities, as well as supporting companies such as Micron Technology and Tokyo Electron, the university is working to strengthen human resource development and research in the semiconductor field. Furthermore, in June 2025, HU signed an agreement with the University of Idaho to establish a branch campus of the University of Idaho within its Higashi-Hiroshima Campus. Preparations are currently underway in collaboration with the University of Idaho to launch a bachelor’s degree program in August 2026 aimed at nurturing global talent in the semiconductor field. In this program, students will spend the first two years at the Higashi-Hiroshima Campus and the final two years at the main campus of the University of Idaho in the United States.

As the global semiconductor market continues to expand, HU is strengthening its efforts to develop global talent and promote internationalized education by advancing joint research and encouraging companies in Saijo City to host student internships, in collaboration with the local community, through its partnership with Saijo City in Ehime Prefecture, where many semiconductor-related companies are located.

HU President Ochi

Saijo City Mayor Takahashi

Signing the Agreement [1]

Signing the Agreement [2]

During the Signing Ceremony

Commemorative Photograph

Inquiries

Global Strategy Group, Hiroshima University

Email: kokusai-group*office.hiroshima-u.ac.jp
(Please replace * with @.)


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