On May 21, 2023, Hiroshima University (HU) and Purdue University, signed an inter-university international exchange agreement to promote academic and educational exchange. Purdue University boasts the most extensive STEM Education (Science, Technology, Engineering, and Mathematics) in the United States, and is a leader in semiconductor human resource development. On the occasion of the signing of the agreement, Purdue University President Dr. Mung Chiang, and Senior Vice President Dr. Wilcox, paid a courtesy visit to the Kasumi Campus of HU, and met with HU President Mitsuo Ochi, Executive Vice President in charge of Global Initiatives, Shinji Kaneko, Executive Vice President in charge of Kasumi Campus, Faculty Personnel and Public Relations, Junko Tanaka and Director of the Research Institute for Nanodevices, Akinobu Teramoto.

During the discussion, it was agreed to use academic and educational exchange programs in the field of semiconductors as a university-wide strategic partnership project, and to also develop cooperation in a wide variety of other areas.

Both universities are engaged in UPWARDS for the Future, a Japan-US semiconductor human resources development partnership involving 11 American and Japanese universities, in addition to companies such as Micron and Tokyo Electron. The presidents of the two universities signed the UPWARDS for the Future Memorandum of Understanding (MOU) as representatives of the US and Japanese universities during the national-level education agreement signing ceremony held in Hiroshima in conjunction with the G7 Hiroshima Summit, attended by MEXT Minister Keiko Nagaoka and US Secretary of State Antony Blinken.

HU has concluded 23 inter-university international exchange agreements with 22 American universities and currently has 13 students from the US studying at HU.
With this visit and the signing of the MOU, we hope to promote exchanges with Purdue University and other American universities and research institutions.