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On January 23, 2024, Hiroshima University (HU) agreed to strengthen new collaboration in the field of semiconductor technologies with National Tsing Hua University (NTHU) in Taiwan, one of HU’s inter-university international exchange agreement partners and a leading comprehensive research university in East Asia, and held a signing ceremony for a memorandum of understanding on student exchange in the semiconductor field at the same time.
Upon the signing of this MOU, HU President Mitsuo Ochi, Executive Vice President for Global Initiatives Shinji Kaneko, and Professor Akinobu Teramoto, Director of HU’s Research Institute for Nanodevices, paid a courtesy visit to NTHU and met with President Kao, Vice President Yen, and Professor Lin. After the signing ceremony, the participants visited the semiconductor facilities on campus.
NTHU is a comprehensive research university offering degree programs in a wide variety of fields including science, technology, engineering, humanities, social sciences, and management. It has produced many world-class researchers and is widely recognized as an incubator for future leaders.
Since the signing of the inter-university international exchange agreement in March 2017, the two universities have conducted student exchanges through the HU Study Abroad Program (HUSA) and other programs.
It is hoped that this MOU will be an opportunity to promote exchange between HU and NTHU.
During the Meeting
Commemorative Photograph at the Signing Ceremony
(Left: President Ochi, Right: President Kao)
Commemorative Photograph of the Participants
Office of Global Initiatives, Hiroshima University